Product Description:
Part Number: BSM100GD120DN2 IGBT Power Module, 3-phase full-bridge, 0.182 K/W, 2500V, ECONOPACK 3
Description:
The
BSM100GD120DN2 is an IGBT module.
Parametrics
BSM100GD120DN2 maximum ratings: (1)Chip temperature Tj: + 150 ℃; (2)Storage temperature Tstg: -55 to + 150 ℃; (3)Thermal resistance, chip case RthJC ≤ 0.182 K/W; (4)Diode thermal resistance, chip case RthJCD ≤ 0.36; (5)Insulation test voltage, t = 1min. Vis: 2500 Vac; (6)Creepage distance: - 16 mm; (7)Clearance: - 11; (8)DIN humidity category, DIN 40 040: F; (9)IEC climatic category, DIN IEC 68-1: 55 / 150 / 56.
Features
Quantity Available: more than 12, 000 pieces
Package Case: New and Original Package
Date Code: 2013+ Rohs
Lead Time / Delivery Time: IN STOCK, SHIP WITHIN 1-3 DAY
Distributor/ Supplier: ICBOND ELECTRONICS LIMITED
Company Contact:
Contact Name: Paul
Company Name: Icbond Electronics Limited
Email: Icbond Electronics Limited
Tel: 00852-28150191
Fax:
Street Address: Unit D, 11/f., Wing
Tat Comm. Bldg., 97 Bonham Strand
East, Sheung Wan
Hk, Hk 999077
Hong Kong
Member name: IcbondElectronicsLimite
Country:
Hong Kong
Member Since: 05 August 2013
Total Leads:
525 IcbondElectronicsLimite Import Export Business Leads
Business focus: Electronic Components, Integrated Circuits, Ic Chips, Semiconductors, Diodes, Capacitors
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