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Cmp Polishing Slurry
Posted at: Offers to Sell and Export | Posted on: Monday 17 May 2010 6:46 am | Poster last visit: Thursday 14 December 2023 |
Product Category: Main
» Industrial Manufacturing and Processing Machinery and Accessories
» Lapidary machinery and equipment
» Grinding and sanding and polishing equipment and supplies
» Polishing compounds
» Cmp Polishing Slurry
Product Description:
GRISH Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity de-ionized
water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.
GRISH CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. GRISH supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price.
Features：
● High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
● Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
● High purity: the content of Cu2+＜50 ppb, without contamination on the work piece
● Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
Typical Properties
Alkaline Type
pH: 9.8±0.5 SOQ-2 SOQ-4 SOQ-6 SOQ-8 SOQ-10 SOQ-12
Acidic Type
pH: 2.8±0.5 ASOQ-2 ASOQ-4 ASOQ-6 ASOQ-8 ASOQ-10 ASOQ-12
Grit Size(nm) 10~30 30~50 50~70 70~90 90~110 110~130
Appearance Milk white or semitransparent liquid
Density (g/ml) 1. 15±0.05
Component Content（wt%）
SiO2 15～30
Na2O ≤0.3
Heavy metal impurity ≤50 ppb
Silica Wafer Polishing Reference Data
Polishing Pressure 150 ～ 250 g/cm2
Polishing Temperature 32 ~ 40 °C (89 ~ 104 °F)
Dilution 1:1 - 20
Polishing duration 3 ~ 6 minutes
Packaging:
500 ml/bottle, 25 kg or 200 kg/barrel.
Customizations are available upon requests.
Storage:
Keep the stored temperature at 0~35℃ (32~95 °F). Frozen can result in irreversible product degradation below 0 ℃. High temperature above 35 ℃ may accelerate the growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is about half a year.
Company Contact:
Contact Name: Jacida Sun
Company Name: Beijing Grish Hitech Co., Ltd.
Email:
Tel: 0086-10-51653168
Fax: 0086-10-82890973
Street Address: Rm402, Block C,
Zhongguancun Development
Building, No. 12, Shangdi
Information Rd., haidian
District, Beijing, China
100085
Other Contact Info:
Whatsapp: +86-13811013670
Website: https://grish.com
Member name: bjgrish
Country:
China
Member Since: 17 May 2010
Total Leads: 24 bjgrish Import Export Business Leads
Business focus: Lapping Film, Diamond Slurry, Diamond Powder, Polishing Products, Diamond Paste
Chat:
Verify: Safe Import Export Tips
water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.
GRISH CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. GRISH supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price.
Features：
● High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
● Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
● High purity: the content of Cu2+＜50 ppb, without contamination on the work piece
● Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
Typical Properties
Alkaline Type
pH: 9.8±0.5 SOQ-2 SOQ-4 SOQ-6 SOQ-8 SOQ-10 SOQ-12
Acidic Type
pH: 2.8±0.5 ASOQ-2 ASOQ-4 ASOQ-6 ASOQ-8 ASOQ-10 ASOQ-12
Grit Size(nm) 10~30 30~50 50~70 70~90 90~110 110~130
Appearance Milk white or semitransparent liquid
Density (g/ml) 1. 15±0.05
Component Content（wt%）
SiO2 15～30
Na2O ≤0.3
Heavy metal impurity ≤50 ppb
Silica Wafer Polishing Reference Data
Polishing Pressure 150 ～ 250 g/cm2
Polishing Temperature 32 ~ 40 °C (89 ~ 104 °F)
Dilution 1:1 - 20
Polishing duration 3 ~ 6 minutes
Packaging:
500 ml/bottle, 25 kg or 200 kg/barrel.
Customizations are available upon requests.
Storage:
Keep the stored temperature at 0~35℃ (32~95 °F). Frozen can result in irreversible product degradation below 0 ℃. High temperature above 35 ℃ may accelerate the growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is about half a year.
Company Contact:
Contact Name: Jacida Sun
Company Name: Beijing Grish Hitech Co., Ltd.
Email:
Tel: 0086-10-51653168
Fax: 0086-10-82890973
Street Address: Rm402, Block C,
Zhongguancun Development
Building, No. 12, Shangdi
Information Rd., haidian
District, Beijing, China
100085
Other Contact Info:
Whatsapp: +86-13811013670
Website: https://grish.com
Member name: bjgrish
Country:
ChinaMember Since: 17 May 2010
Total Leads: 24 bjgrish Import Export Business Leads
Business focus: Lapping Film, Diamond Slurry, Diamond Powder, Polishing Products, Diamond Paste
Chat:
Verify: Safe Import Export Tips
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Polishing compounds Classification Navigation
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