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High Density Interconnect Hdi Pcb Circuit Board Fabrication
Posted at: Offers to Sell and Export | Posted on: Monday 14 September 2020 6:27 am | Poster last visit: Monday 14 September 2020 |
Product Category: Main
» Industrial Production and Manufacturing Services
» Manufacturing support services
» Assembly services
» Electronics manufacturing service
» High Density Interconnect Hdi Pcb Circuit Board Fabrication
Product Description:
HDI boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect
board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI high density interconnect pcb boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMing uses laser-drilled microvias electroplated with copper.
Company Contact:
Contact Name: Suzy
Company Name: Hitech Circuits Co., Ltd.
Email:
Tel: 86-755-29630063-805
Fax: 86-755-29970700
Street Address: Shajing Road
Shenzhen, Guangdong 518105
China
Website: https://hitechcircuits.com
Member name: hitechpcb
Country:
China
Member Since: 11 December 2019
Total Leads: 14 hitechpcb Import Export Business Leads
Business focus: Pcb, Pcba, Double Sided Pcb Multilayer Pcb
Chat:
Verify: Safe Import Export Tips
board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI high density interconnect pcb boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMing uses laser-drilled microvias electroplated with copper.
Company Contact:
Contact Name: Suzy
Company Name: Hitech Circuits Co., Ltd.
Email:
Tel: 86-755-29630063-805
Fax: 86-755-29970700
Street Address: Shajing Road
Shenzhen, Guangdong 518105
China
Website: https://hitechcircuits.com
Member name: hitechpcb
Country:
ChinaMember Since: 11 December 2019
Total Leads: 14 hitechpcb Import Export Business Leads
Business focus: Pcb, Pcba, Double Sided Pcb Multilayer Pcb
Chat:
Verify: Safe Import Export Tips
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