Product Description:
Microelectronic Package
Product Description
Computer CPU, DSC chips
Integrated Circuit Package Housings
Carriers
Radar
Microwave modules
Semiconductor Wafers
Electronic Communications Devices
Materials:Silicon Aluminum Alloys(AlSi Alloys)
Configuration:Platforms, Plug-ins, Flatpacks, TO Headers etc.
Advantages
CTE match to circuit boards and components;
High thermal conductivity and outstanding heat dissipation;
Low density;
Hermeticity;
Dimensional stability;
Corrosion Resistance;
Wafer Level Packaging;
Ease of manufacture.
AlSi Alloys Performance Parameters
Content Density
g/cm³ CTE
ppm/℃ Thermal Conductivity
W/mK Tensile Strength
MPa Yield Strength
MPa Poisson's Ratio Elongation
% Elastic Modulus
GPa
Al-27%Si 2.6 17 175 170 130 0.29 3.8 91
Al-42%Si 2.55 13.5 160 200 187 0.29 1 105
Al-50%Si 2.5 11.5 140 220 210 0.28 <1 108
Al-60%Si 2.46 10 125 210 210 0.27 <1 111
Al-70%Si 2.43 7.5 120 135 135 0.27 <1 114
Company Contact:
Contact Name: Vikcy Wang
Company Name: Tianjin Baienwei New Material Technology Co., Ltd
Email:
Tel: (+86-022)29291825
Fax: (+86-022)29291821
Street Address: No.13, Baofu Road,
Economic Development District,
Baodi, Tianjin, China.
Tianjin, Tianjin 300000
China
Website:
https://www.baienwei.net
Member name: baienwei
Country:
China
Member Since: 26 May 2016
Total Leads:
11 baienwei Import Export Business Leads
Business focus: Silicon Aluminum Alloy, Al Si Alloy Electronic Packaging
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