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Xc3s400a-4ftg256c Xilinx Field-programmable Gate Array, 1.67 Ma, 1.32 V, Bga
Posted at: Offers to Sell and Export | Posted on: Wednesday 3 September 2014 2:49 am | Poster last visit: Tuesday 25 November 2014 |
Product Category: Main
» Electronic Components and Supplies
» Printed circuits and integrated circuits and microassemblies
» Integrated circuits
» Standard logic integrated circuit
» Xc3s400a-4ftg256c Xilinx Field-programmable Gate Array, 1.67 Ma, 1.32 V, Bga
Product Description:
Manufacturer Part Number: XC3S400A-4FTG256C Xilinx Field-Programmable Gate Array, 1.67 mA, 1.32 V, BGA
Brife
Description:
The XC3S400A-4FTG256C is a Field-Programmable Gate Array specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The XC3S400AN-5FGG400C offers densities ranging from 50, 000 to five million system gates. The XC3S400A-4FTG256C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from state-of-the-art Virtex.-II technology. The XC3S400A-4FTG256C enhancements, combined with advanced process technology, delivers more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Parametrics
XC3S400A-4FTG256C absolute maximum ratings: (1)VCCINT Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO Output driver supply voltage: –0.5 to 3.75 V; (4)VREF Input reference voltage: –0.5 VCCO+0.5 V; (5)TJ Junction temperature VCCO < 3.0V: - 125 ℃; (6)VCCO > 3.0V - 105 ℃; (7)TSOL Soldering temperature: - 220 ℃; (8)TSTG Storage temperature: –65 150 ℃.
Features
XC3S400A-4FTG256C features: (1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Eight global clock lines and abundant routing; (4)Fully supported by Xilinx ISE development system. Synthesis, mapping, placement and routing; (5)MicroBlaze processor, PCI, and other cores; (6)Digital Clock Manager (up to four DCMs); (7)Select RAM. hierarchical memory.
Lead Time / Delivery Time: IN STOCK, SHIP WITHIN 1-3 DAY
Distributor/ Supplier: ICBOND ELECTRONICS LIMITED
Company Contact:
Contact Name: Paul
Company Name: Icbond Electronics Limited
Email: Icbond Electronics Limited
Tel: 00852-28150191
Fax:
Street Address: Unit D, 11/f., Wing
Tat Comm. Bldg., 97 Bonham Strand
East, Sheung Wan
Hk, Hk 999077
Hong Kong
Member name: IcbondElectronicsLimite
Country:
Hong Kong
Member Since: 05 August 2013
Total Leads: 525 IcbondElectronicsLimite Import Export Business Leads
Business focus: Electronic Components, Integrated Circuits, Ic Chips, Semiconductors, Diodes, Capacitors
Chat:
Verify: Safe Import Export Tips
Brife
Description:
The XC3S400A-4FTG256C is a Field-Programmable Gate Array specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The XC3S400AN-5FGG400C offers densities ranging from 50, 000 to five million system gates. The XC3S400A-4FTG256C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from state-of-the-art Virtex.-II technology. The XC3S400A-4FTG256C enhancements, combined with advanced process technology, delivers more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Parametrics
XC3S400A-4FTG256C absolute maximum ratings: (1)VCCINT Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO Output driver supply voltage: –0.5 to 3.75 V; (4)VREF Input reference voltage: –0.5 VCCO+0.5 V; (5)TJ Junction temperature VCCO < 3.0V: - 125 ℃; (6)VCCO > 3.0V - 105 ℃; (7)TSOL Soldering temperature: - 220 ℃; (8)TSTG Storage temperature: –65 150 ℃.
Features
XC3S400A-4FTG256C features: (1)Revolutionary 90-nanometer process technology; (2)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3)Eight global clock lines and abundant routing; (4)Fully supported by Xilinx ISE development system. Synthesis, mapping, placement and routing; (5)MicroBlaze processor, PCI, and other cores; (6)Digital Clock Manager (up to four DCMs); (7)Select RAM. hierarchical memory.
Lead Time / Delivery Time: IN STOCK, SHIP WITHIN 1-3 DAY
Distributor/ Supplier: ICBOND ELECTRONICS LIMITED
Company Contact:
Contact Name: Paul
Company Name: Icbond Electronics Limited
Email: Icbond Electronics Limited
Tel: 00852-28150191
Fax:
Street Address: Unit D, 11/f., Wing
Tat Comm. Bldg., 97 Bonham Strand
East, Sheung Wan
Hk, Hk 999077
Hong Kong
Member name: IcbondElectronicsLimite
Country:
Hong KongMember Since: 05 August 2013
Total Leads: 525 IcbondElectronicsLimite Import Export Business Leads
Business focus: Electronic Components, Integrated Circuits, Ic Chips, Semiconductors, Diodes, Capacitors
Chat:
Verify: Safe Import Export Tips
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Standard logic integrated circuit Classification Navigation
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