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Xcf128xftg64c Xilinx Bga, Platform Flash, Xl High-density Configuration
Posted at: Offers to Sell and Export | Posted on: Thursday 21 August 2014 2:02 pm | Poster last visit: Tuesday 25 November 2014 |
Product Category: Main
» Electronic Components and Supplies
» Printed circuits and integrated circuits and microassemblies
» Circuit assemblies and radio frequency RF components
» Amplifiers
» Xcf128xftg64c Xilinx Bga, Platform Flash, Xl High-density Configuration
Product Description:
Manufacturer Part Number: XCF128XFTG64C Xilinx BGA, platform flash, XL high-density configuration, storage
device, 50 MHz 16-bits, 800 Mb/s
Description:
The XCF128XFTG64C is a platform flash XL high-density configuration and storage device. A reliable compact high-performance configuration bitstream storage and delivery solution is essential for the high-density FPGAs. Platform Flash XL of the XCF128XFT64C is the industry highest performing configuration and storage device and is specially optimized for high-performance FPGA configuration. Platform Flash XL integrates 128 Mb of in-system programmable flash storage and performance of the XCF128XFT64C features for configuration within a small-footprint FT64 package (Figure 5). Power-on burst read mode and dedicated I/O power supply of the XCF128XFT64C enable Platform Flash XL to mate seamlessly with the native SelectMAP configuration interface. A wide, 16-bit data bus delivers the FPGA configuration bitstream at speeds up to 800 Mb/s without wait states. See UG438, Platform Flash XL Configuration and Storage Device User Guide of the XCF128XFT64C, for system-level usage and performance considerations.
Parametrics
XCF128XFTG64C absolute maximum ratings: (1)TA Ambient operating temperature: –40 to 85 ℃; (2)TBIAS Temperature under bias: –40 to 85 ℃; (3)TJ Junction temperature: – 125 ℃; (4)TSTG Storage temperature: –65 to 125 ℃; (5)VIO Input or output voltage: –0.5 to 4.2 V; (6)VDD Supply voltage: –0.2 to 2.5 V; (7)VDDQ Input/output supply voltage: –0.2 to 3.8 V; (8)VPP Program voltage: –0.2 to 10 V; (9)IO Output short circuit current: – 100 mA; (10)TVPPH Time for VPP at VPPH: – 100 hours.
Quantity Available: more than 12, 000 pieces
Package Case: New and Original Package
Date Code: 2013/14+ Rohs
Lead Time / Delivery Time: IN STOCK, SHIP WITHIN 1-3 DAY
Distributor/ Supplier: ICBOND ELECTRONICS LIMITED
Company Contact:
Contact Name: Paul
Company Name: Icbond Electronics Limited
Email: Icbond Electronics Limited
Tel: 00852-28150191
Fax:
Street Address: Unit D, 11/f., Wing
Tat Comm. Bldg., 97 Bonham Strand
East, Sheung Wan
Hk, Hk 999077
Hong Kong
Member name: IcbondElectronicsLimite
Country: Hong Kong
Member Since: 05 August 2013
Total Leads: 525 IcbondElectronicsLimite Import Export Business Leads
Business focus: Electronic Components, Integrated Circuits, Ic Chips, Semiconductors, Diodes, Capacitors
Chat:
Verify: Safe Import Export Tips
device, 50 MHz 16-bits, 800 Mb/s
Description:
The XCF128XFTG64C is a platform flash XL high-density configuration and storage device. A reliable compact high-performance configuration bitstream storage and delivery solution is essential for the high-density FPGAs. Platform Flash XL of the XCF128XFT64C is the industry highest performing configuration and storage device and is specially optimized for high-performance FPGA configuration. Platform Flash XL integrates 128 Mb of in-system programmable flash storage and performance of the XCF128XFT64C features for configuration within a small-footprint FT64 package (Figure 5). Power-on burst read mode and dedicated I/O power supply of the XCF128XFT64C enable Platform Flash XL to mate seamlessly with the native SelectMAP configuration interface. A wide, 16-bit data bus delivers the FPGA configuration bitstream at speeds up to 800 Mb/s without wait states. See UG438, Platform Flash XL Configuration and Storage Device User Guide of the XCF128XFT64C, for system-level usage and performance considerations.
Parametrics
XCF128XFTG64C absolute maximum ratings: (1)TA Ambient operating temperature: –40 to 85 ℃; (2)TBIAS Temperature under bias: –40 to 85 ℃; (3)TJ Junction temperature: – 125 ℃; (4)TSTG Storage temperature: –65 to 125 ℃; (5)VIO Input or output voltage: –0.5 to 4.2 V; (6)VDD Supply voltage: –0.2 to 2.5 V; (7)VDDQ Input/output supply voltage: –0.2 to 3.8 V; (8)VPP Program voltage: –0.2 to 10 V; (9)IO Output short circuit current: – 100 mA; (10)TVPPH Time for VPP at VPPH: – 100 hours.
Quantity Available: more than 12, 000 pieces
Package Case: New and Original Package
Date Code: 2013/14+ Rohs
Lead Time / Delivery Time: IN STOCK, SHIP WITHIN 1-3 DAY
Distributor/ Supplier: ICBOND ELECTRONICS LIMITED
Company Contact:
Contact Name: Paul
Company Name: Icbond Electronics Limited
Email: Icbond Electronics Limited
Tel: 00852-28150191
Fax:
Street Address: Unit D, 11/f., Wing
Tat Comm. Bldg., 97 Bonham Strand
East, Sheung Wan
Hk, Hk 999077
Hong Kong
Member name: IcbondElectronicsLimite
Country:
Hong KongMember Since: 05 August 2013
Total Leads: 525 IcbondElectronicsLimite Import Export Business Leads
Business focus: Electronic Components, Integrated Circuits, Ic Chips, Semiconductors, Diodes, Capacitors
Chat:
Verify: Safe Import Export Tips
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